International Roadmap for Devices and Systems (IRDS™) 2024 Edition
2024 IRDS Executive Documents
From the Chairman - IRDS Prologue
Paolo Gargini, IRDS chairman, offers this Prologue to the 2024 IRDS, which provides insight into the future years for devices and systems, and encourages the users of the IRDS roadmaps to also read the Executive Tutorials that are offered as part of the 2024 IRDS suite of reports. Read the full prologue…
Executive Summary
This initiative focuses on an International Roadmap for Devices and Systems (IRDS) through the work of International
Focus Teams (IFT) closely aligned with the advancement of the devices and systems industries. Led by the
International Roadmap Committee (IRC), IFTs collaborated in the development of the 2022 IRDS roadmap, and
engaged with other segments of the IEEE, such as the Rebooting Computing Initiative (RCI), Electron Devices Society
(EDS), Computer Society (CS), Communication Society (ComSoc), and other societies as well as with related industry
and academic communities like the System and Device Roadmap Committee of Japan (SDRJ) and the European
SINANO Institute (ESI) in complementary activities to help ensure alignment and consensus across a range of
stakeholders.
Executive Packaging Tutorial - Part 1
The Executive Packaging Tutorial (EPT) sheds some light on the adoption, evolution and transformation of multi-chip modules (MCMs) in the era of high-performance computing (HPC) and artificial intelligence (AI) to help the reader to better comprehend the drivers and the roles of the fundamental building blocks of this technology revolution in a neutral and objective way.
The EPT has been published as a set, each part addressing aspects of integrated circuit packaging with a focus on developing trends for high performance computing and artificial intelligence application. Read the full Part 1 of the tutorial…
Executive Packaging Tutorial - Part 2
This report is Part 2 of the EPT designed to provide the reader with the evolution of System on Chip (SoC), System in Package (SiP), and future trends of device and system integration technologies. Read the full Part 2 of the tutorial…
2024 IRDS International Focus Teams (IFTs) Roadmap Reports
ESHS Series:: Environmental Sustainability of the Semiconductor Facilities
Growing semiconductor facilities drive increasing environmental footprint, including high energy demand, high freshwater withdrawal, carbon emission, and other GHG (Green House Gas) and waste related emissions. Whereas in the past the sustainability performance was associated with general social responsibility and cost related benefits, it is now becoming mission critical for the industry.
ESH/S IFT (Environmental, Safety, Health and Sustainability International Focus Team) comprises of a number of focus teams, driven by current ESH/S priority. This includes Environmental Sustainability of the Semiconductor Facilities (ESSF), Supply Chain, Materials Fab Process, and Product Content (circularity). ESH/S IFT has recognized the urgency and the importance of dealing with this challenge, forming a focus team to analyze technology gaps and opportunities in the space of Environmental Sustainability of the Semiconductor Facilities. This document is a sub-chapter of ESH/S chapter and produced as an individual document to support the growing focus on this topic and help the audience with specific technology roadmap set of materials in the area. The forum operated throughout all time zones, regions, and geographies, including major semiconductor manufacturers, tool suppliers, and facility technology providers to ensure completeness of the assessment and the input into the roadmap.
The process of the roadmap development started from the analysis of the technology drivers, boundaries, and considerations. The drivers were assessed for the risk of their effect to the industry and specific technologies responsible for operating facilities within the boundaries identified. Read the full chapter…
Autonomous Machine Computing - White Paper
The field of Embodied AI marks a significant evolution in how AI and robotics intersect to enable autonomous, adaptive, and intelligent systems. By embedding cognitive capabilities within physical entities, Embodied AI equips machines to interact meaningfully with their environments, merging perception, decision-making, and action in a seamless loop. This 2024 update to the Autonomous Machine Computing White Paper under IEEE IRDS reflects on the transformative milestones that have shaped Embodied AI, from the early conceptual foundations of machine perception to today’s sophisticated multimodal learning models. As Embodied AI continues to integrate advances in deep learning, autonomous machine computing, and sensory data processing, it holds the potential to redefine industries and elevate human-machine collaboration. This paper not only explores the current challenges and innovations in Embodied AI—from foundational model-building and specialized computing infrastructures to the pivotal role of data—but also addresses the societal, ethical, and regulatory frameworks needed to guide Embodied AI’s responsible integration into our lives. Read the full white paper…
Lithography and Patterning
Historically, improvements in lithography have been key enablers to make improved chip technologies. The International Roadmap for Devices and Systems (IRDS) Lithography roadmap predicts how current patterning capability can support future chip generations and where challenges and improvements are needed. It gives a roadmap of expected key lithography requirements. It is intended to be used by semiconductor industry participants, by industry analysts, and by researchers who want or need to know how the industry will evolve in the future and what challenges need to be addressed. Read the full chapter…
Outside System Connectivity
Yield Enhancement
The Yield Enhancement Chapter of IRDS is dedicated to ensuring that semiconductor wafer processing environment is best equipped for identifying, reducing, and avoiding yield-relevant defects and contamination.
More Moore
The More Moore International Focus Team (IFT) of the International Roadmap of Devices and Systems (IRDS) provides physical, electrical, and reliability requirements for logic and memory technologies to sustain power, performance, area, cost (PPAC) scaling for edge and cloud applications. This is done over a time horizon of 15 years for mainstream/high-volume manufacturing (HVM).
Metrology
The Metrology Chapter identifies emerging measurement challenges and knowledge gaps in devices, systems, and integration in the semiconductor industry and describes research and development pathways for meeting them. This includes, but is not limited to, measurement needs for CMOS transistors, novel devices beyond CMOS, technologies for interconnects and chiplets architectures, and materials characterization for process development in integrated devices and systems. This also includes advances in metrology required for research and development, process control and device / system performance assurance in manufacturing environments.
Beyond CMOS
An overarching goal of this chapter is to survey, assess, and catalog viable emerging devices and novel architectures for their long-range potential and technological maturity and to identify the scientific/technological challenges gating their acceptance by the semiconductor industry as having acceptable risk for further development. This chapter also surveys beyond-CMOS devices for more than Moore (MtM) applications.
Systems and Architectures
The Systems and Architectures section of the roadmap serves as a bridge between application benchmarks and component technologies. The systems analyzed in this section cover a broad range of applications of computing, electronics, and photonics. In this chapter, we identify key challenges and technology requirements by observing the patterns in play in the systems and architectures anticipated during the period under study.